| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a scanning probe suitable to firmly fix a shape-memory alloy such as a Nitinol wire to a circuit board even when a thickness of the circuit board is thick.SOLUTION: A shape-memory alloy 30 is solder-mounted to a PCB (Printed Circuit Board) 29. Specifically, solder abutted on lands is melted by heat. The solder melted by the heat gets wet, spreads, and becomes cold and hard on the lands to form solder bulge parts 29f. Thereby, portions extended along the lands of the shape-memory alloy 30 are fixed to a formed product. A part of the solder having got wet and spread on each land flows into a metal pipe 29e, and gets wet and spreads on an inner circumferential face of the metal pipe 29e. The solder having got wet and spread on the inner circumferential face of each metal pipe 29e becomes cold and hard, so that the shape-memory alloy 30 is fixed inside the metal pipe 29e.</p> |
