发明名称 ELECTROLESS PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electroless plating method capable of performing catalytic treatment by previously applying metal colloid to form a plating film and achieving excellent adhesion even when applied to a smooth inorganic substrate.SOLUTION: In the electroless plating method for performing silane coupling treatment to an inorganic substrate surface to form a plating film by electroless plating treatment, the silane coupling treatment is performed by a vapor growth method and preferably uses a silane coupling agent having one of an amino group, a mercapto group and an isocyanurate group. The catalytic treatment is preferably performed by applying colloid by an inkjet method.
申请公布号 JP2015021167(A) 申请公布日期 2015.02.02
申请号 JP20130150395 申请日期 2013.07.19
申请人 ELECTROPLATING ENG OF JAPAN CO;OSAKA UNIV 发明人 ITO MASAHIRO;TAKEYA JUNICHI
分类号 C23C18/18;H05K3/18 主分类号 C23C18/18
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