| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic element ensuring an insulation gap of a back side conductive part and a heat sink, when a base plate is bent to the heat sink side, in an electronic element surface mounted on the base plate and configured to dissipate heat from the back side conductive part to the heat sink via an insulation heat dissipating material.SOLUTION: An electronic element 301 surface mounted on a base plate 2, and configured to dissipate heat from a back electrode 36 to a heat sink 6 via a heat dissipation gel 5 includes an insulating leg 41 projecting to the heat sink 6 side for the back plane 33 around the back electrode 36. Consequently, when the base plate 2 bends to the heat sink 6 side with a support part 64 as a fulcrum, the leg 41 abuts against a heat receiving surface 63 earlier than the back electrode 36. As a result, an insulation gap &Dgr;s of the back electrode 36 and the heat sink 6 is ensured, and breakdown of the electronic element 301 due to short circuit can be prevented. |
