| 摘要 |
<p>An objective of the present invention is to minimize a substrate cleaning apparatus for cleaning a rear surface of a wafer (W), and improve a detergency of a substrate cleaning process. Provided are first and second cleaning members (6A, 6B) to clean a central region in a rear surface of a wafer (W) when the wafer (W) is held by an absorption pad (2) and horizontally moved, and to clean a peripheral region in the rear surface of the wafer (W) when the wafer (W) is held by the spin chuck (3). Because the first and second cleaning members (6A, 6B) are provided as describe, detergency can be improved compared to when only one cleaning member is used. Also, the first and second cleaning members (6A, 6B) are configured to be horizontally turned by a common turning shaft (52). However, when the central region in the rear surface of the wafer (W) is cleaned, the turning shaft (52) is located to be overlapped with the wafer (W). Since the turning shaft (52) is located by using the moving area of the wafer (W), a size of an apparatus can be reduced.</p> |
