| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device housing and its manufacturing method in which excellent metal feeling is included even without forming a metal layer on an outer surface, and the manufacturing process is simple.SOLUTION: An electronic device housing of the present invention comprises a metal-made outer case and an inner case housed in the outer case. The outer case provides a bottom plate and a periphery wall which is formed as bending respectively upward from the periphery edge of the bottom plate, a projected hook is formed on the inner surface of the bottom plate of the outer case, and, on the inner surface of the periphery wall of the outer case, formed is a housing groove which extends along the periphery edge of the periphery wall. The inner case is made of alloy material and is engaged with the inner surface of the outer case by a die casting molding method, and, at the place at which the outer surface of the inner case is connected with the outer case, a connecting groove under cooperation with the hook and a first projection under cooperation with the housing groove are provided. |
