发明名称 |
THERMALLY CONDUCTIVE SHEET, AND THERMALLY CONDUCTIVE SHEET WITH RELEASE SHEET |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thermally conductive sheet which can exhibit excellent thermal conductivity when bonded to an adherend.SOLUTION: This invention relates to a thermally conductive sheet in a semi-cured state comprising a thermosetting resin, and an inorganic filler having a higher coefficient of thermal conductivity than the thermosetting resin, wherein the thermally conductive sheet has a surface with a roughness Rz of 2μm or more and 30μm or less.</p> |
申请公布号 |
JP2015021025(A) |
申请公布日期 |
2015.02.02 |
申请号 |
JP20130148355 |
申请日期 |
2013.07.17 |
申请人 |
NITTOSHINKO CORP |
发明人 |
ISHIZAKA TAKESHI ; NAKAO MAKI |
分类号 |
C08L101/00;B29B11/12;B32B7/02;C08J5/18;C08K3/00 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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