发明名称 THERMALLY CONDUCTIVE SHEET, AND THERMALLY CONDUCTIVE SHEET WITH RELEASE SHEET
摘要 <p>PROBLEM TO BE SOLVED: To provide a thermally conductive sheet which can exhibit excellent thermal conductivity when bonded to an adherend.SOLUTION: This invention relates to a thermally conductive sheet in a semi-cured state comprising a thermosetting resin, and an inorganic filler having a higher coefficient of thermal conductivity than the thermosetting resin, wherein the thermally conductive sheet has a surface with a roughness Rz of 2μm or more and 30μm or less.</p>
申请公布号 JP2015021025(A) 申请公布日期 2015.02.02
申请号 JP20130148355 申请日期 2013.07.17
申请人 NITTOSHINKO CORP 发明人 ISHIZAKA TAKESHI ; NAKAO MAKI
分类号 C08L101/00;B29B11/12;B32B7/02;C08J5/18;C08K3/00 主分类号 C08L101/00
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