| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a chip resistor capable of preventing chipping from being generated in a cross portion of a primary dividing groove and a secondary dividing groove.SOLUTION: On one side of a large-sized substrate 20, a primary dividing groove 21 with uneven depth is formed and after forming a plurality of couples of surface electrodes 3 over the primary dividing groove 21 or a resistor 5 or the like spread over paired surface electrodes 3, primary division is performed on the large-sized substrate 20 along the primary dividing groove 21 so as to open the side where the surface electrodes 3 or the resistor 5 is formed, thereby obtaining a plurality of short-strip substrates 30 from the large-sized substrate 20. In the case of such primary division, the primary dividing groove 21 starts being divided from an electrode formation area which is shallow in groove depth and strong and thereafter, a cross portion which is deep in groove depth and weak is divided. Therefore, primary division can be performed without applying a heavy load to the cross portion of a low strength, and chipping can be prevented from being generated in the cross portion. |
