| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce an exterior package temperature in the case where a distance between an electric element to outside air is reduced for attaining downsizing.SOLUTION: An electronic apparatus comprises: an exterior package 32 formed from a resin material; an exterior package formed from a circuit board resin material, with which electric elements 26 and 28 of heating sources are packaged at the external packaging side; and a board holding member 33 for holding a circuit board at the external packaging side of the circuit board. The board holding member 33 includes notches 34a and 34b exposing outer shapes of the electric elements. The notches are covered by a thermal diffusion member 36 which is disposed while being overlapped at the external packaging side of the board holding member. At the external packaging side of the thermal diffusion member, a heat insulation member 37 as large as or larger than the thermal diffusion member is disposed while being overlapped. At the circuit board side of the exterior package, a heat conduction member 38 is fixed, and a projection area of the heat conduction member is larger than that of the heat insulation member.</p> |
