| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition, an underfill agent and an adhesive which have high thermal conductivities, and a semiconductor device using the epoxy resin composition.SOLUTION: An epoxy resin composition contains (A) a liquid epoxy resin, (B) an amine curing agent, (C) an inorganic filler, and (D) an amine alkyleneoxide addition product. The (D) component has a structure represented by the following formula (1). In the formula, R represents a hydrogen atom or an alkyl group, and X and Y each independently represent an average addition molar number of oxyalkylene groups. |
