发明名称 LID BODY PART, PACKAGE FOR ELECTRONIC DEVICE USING THIS LID BODY PART, AND ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a lid body part in which the mounting rate of an electronic device element is improved, and also to provide a package for an electronic device and an electronic device equipped with the same.SOLUTION: Disclosed is a lid body part 2 including a recess 5 in which a space part 4 is formed by a bottom part 2A and a side plate part 2B, and a collar part 6 extending from an outer edge part of an opening 2C side of the recess 5 to the outside. In a side plate inner surface 10 which is a surface on the space par side 4 of the recess 5 out of the side plate part 2B, the lid body part 2 is provided which is inclined to the outside of the space part 4.
申请公布号 JP2015023052(A) 申请公布日期 2015.02.02
申请号 JP20130147628 申请日期 2013.07.16
申请人 SEIKO INSTRUMENTS INC;KAGA INC 发明人 KANEKO SHUHEI;SATO MASAYUKI;TAKANO KENJI;AKIBA MITSUO;TAKEUCHI HITOSHI
分类号 H01L23/02;H01L23/04 主分类号 H01L23/02
代理机构 代理人
主权项
地址
您可能感兴趣的专利