发明名称 |
LID BODY PART, PACKAGE FOR ELECTRONIC DEVICE USING THIS LID BODY PART, AND ELECTRONIC DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a lid body part in which the mounting rate of an electronic device element is improved, and also to provide a package for an electronic device and an electronic device equipped with the same.SOLUTION: Disclosed is a lid body part 2 including a recess 5 in which a space part 4 is formed by a bottom part 2A and a side plate part 2B, and a collar part 6 extending from an outer edge part of an opening 2C side of the recess 5 to the outside. In a side plate inner surface 10 which is a surface on the space par side 4 of the recess 5 out of the side plate part 2B, the lid body part 2 is provided which is inclined to the outside of the space part 4. |
申请公布号 |
JP2015023052(A) |
申请公布日期 |
2015.02.02 |
申请号 |
JP20130147628 |
申请日期 |
2013.07.16 |
申请人 |
SEIKO INSTRUMENTS INC;KAGA INC |
发明人 |
KANEKO SHUHEI;SATO MASAYUKI;TAKANO KENJI;AKIBA MITSUO;TAKEUCHI HITOSHI |
分类号 |
H01L23/02;H01L23/04 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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