发明名称 SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD
摘要 <p>PROBLEM TO BE SOLVED: To improve the accuracy in inspection of a conductor pattern.SOLUTION: A substrate inspection device includes: an inspection unit which executes continuity tests of a plurality of conductor patterns (Pc1 to Pc5) in a circuit board 100b and insulation tests between respective conductor patterns on the basis of electric signals inputted and outputted via probes (31a to 31p); and a control unit which controls connections and non-connections between the plurality of probes being in contact with respective conductor patterns and the inspection unit. In the insulation tests, the control unit connects partial probes out of probes being in contact with conductor patterns which have successfully passed the continuity tests, to the inspection unit and connects at least one probe which is a part of probes being contact with a conductor pattern (Pc4) which has not successfully passed the continuity test, to the inspection unit for each of divided areas Pd1 and Pd2 of the conductor pattern which are divided by a part Pd of defective continuity.</p>
申请公布号 JP2015021864(A) 申请公布日期 2015.02.02
申请号 JP20130150636 申请日期 2013.07.19
申请人 HIOKI EE CORP 发明人 TAKEUCHI GORO;SHIMIZU TAKAHIRO
分类号 G01R31/02;H05K3/00 主分类号 G01R31/02
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