发明名称 |
SILVER-COATED COPPER ALLOY POWDER AND METHOD FOR PRODUCING THE SAME |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a silver-coated copper alloy powder enabling a conductive film having a low volume resistivity and having an excellent storage stability (reliability) and migration resistance to be formed, and a method for producing the same.SOLUTION: The silver-coated copper alloy powder is obtained by: coating a copper alloy powder that has a composition containing at least one of 1 to 50 mass% of nickel and zinc, and the remainder comprising copper and inevitable impurities, with a 7 to 50 mass% silver-containing layer (layer comprising silver or silver compound) (with respect to the silver); then subjecting the copper alloy powder to heat treatment by heating it at 30 to 50°C for 10 to 120 minutes.</p> |
申请公布号 |
JP2015021143(A) |
申请公布日期 |
2015.02.02 |
申请号 |
JP20130147877 |
申请日期 |
2013.07.16 |
申请人 |
DOWA ELECTRONICS MATERIALS CO LTD |
发明人 |
INOUE KENICHI;EBARA ATSUSHI;ASANO AKIHIRO;YAMADA TAKEHIRO;FUJIMOTO HIDEYUKI;OGI KOZO |
分类号 |
B22F1/02;B22F1/00;B22F9/08;C22C9/04;C22C9/06;C22C18/02;C22C19/03;H01B1/00;H01B1/22;H01B5/00;H01B13/00 |
主分类号 |
B22F1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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