| 摘要 |
<p>A liquid resin composition for adhesives which comprises a solvent (A), an epoxy resin (B) having two or more epoxy groups per molecule, an epoxy resin hardener (C) having two or more phenolic hydroxy groups per molecule, and a hardening accelerator (D). It is characterized in that the epoxy resin (B) and the epoxy resin hardener (C) have dissolved in the solvent (A) and the hardening accelerator (D), in the temperature range of from ordinary temperature to a temperature to be used in vaporizing the solvent (A), is present as particles of a visually observable size in a varnish (W), i.e., a solution of the epoxy resin (B) and the epoxy resin hardener (C) in the solvent (A), and in an adhesive layer obtained by removing the solvent (A) from the varnish (W) by vaporization, and the hardening accelerator (D), in the temperature range of from a temperature higher than that temperature to be used in vaporizing the solvent (A) to a curing temperature, becomes particles of a size not observable visually or dissolves in the adhesive layer. The liquid resin composition for adhesives has excellent suitability for continuous printing. After solvent removal by vaporization, the resin composition has satisfactory suitability for semiconductor element mounting thereon and, despite this, is nontacky at room temperature.</p> |
