发明名称 |
PHOTOCURABLE RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a photocurable resin composition in which a polymerization reaction proceeds rapidly by irradiation with active energy rays such as light, and which shows excellent surface curing and in-depth curing.SOLUTION: The photocurable resin composition contains (A) to (C) components. (A) component: an organic polymer having two or more hydrolyzable silyl groups in one molecule. (B) component: a compound which generates an acid or a base by irradiation with light; and (C) component: a compound having at least one aryl group or heterocyclic group bound directly to a silicon atom and having at least one silanol group and a compound selected from the group consisting of a polysiloxane having at least two silanol groups in one molecule. |
申请公布号 |
JP2015021103(A) |
申请公布日期 |
2015.02.02 |
申请号 |
JP20130152214 |
申请日期 |
2013.07.23 |
申请人 |
THREE BOND CO LTD |
发明人 |
SOGA TETSUNORI;KIRINO MANABU |
分类号 |
C08L101/10;C08K5/541;C08L83/04 |
主分类号 |
C08L101/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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