发明名称 PHOTOCURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photocurable resin composition in which a polymerization reaction proceeds rapidly by irradiation with active energy rays such as light, and which shows excellent surface curing and in-depth curing.SOLUTION: The photocurable resin composition contains (A) to (C) components. (A) component: an organic polymer having two or more hydrolyzable silyl groups in one molecule. (B) component: a compound which generates an acid or a base by irradiation with light; and (C) component: a compound having at least one aryl group or heterocyclic group bound directly to a silicon atom and having at least one silanol group and a compound selected from the group consisting of a polysiloxane having at least two silanol groups in one molecule.
申请公布号 JP2015021103(A) 申请公布日期 2015.02.02
申请号 JP20130152214 申请日期 2013.07.23
申请人 THREE BOND CO LTD 发明人 SOGA TETSUNORI;KIRINO MANABU
分类号 C08L101/10;C08K5/541;C08L83/04 主分类号 C08L101/10
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