发明名称 WIRING BOARD AND BOARD MODULE
摘要 PROBLEM TO BE SOLVED: To provide a wiring board in which occurrence of poor insulation can be prevented, and which does not cause short-circuit fault to a mounted connector.SOLUTION: A wiring board 20 includes a wiring pattern 23 formed on the surface of a conductive board 21 via an insulation layer 22, and an extension 23a extended from the wiring pattern 23. The extension 23a of the wiring pattern 23 is laid on a part located directly under an attachment side connector 50. The attachment side connector 50 is connected with a fixed side connector 40. The fixed side connector 40 is mounted on the wiring board 20, and connected fixedly with the wiring pattern 23. A solder resist layer 24 covers the insulation layer 22 and wiring pattern 23. Each land 34a, 34b of an external electrode 34 consists of a part of the wiring pattern 23 exposed from the solder resist layer 24. The fixed side connector 40 is connected fixedly with each land 34a, 34b.
申请公布号 JP2015023265(A) 申请公布日期 2015.02.02
申请号 JP20130153235 申请日期 2013.07.24
申请人 TOYODA GOSEI CO LTD 发明人 MASAJI YOSHINORI;KATO HIDEAKI;MIWA TOMOHIRO
分类号 H05K3/34;H05K1/18 主分类号 H05K3/34
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