| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor light-emitting device, in a case of a semiconductor light-emitting device having, on a substrate, a reflector obtained by an injection molding step of an electron beam curable resin composition containing titanium oxide and an electron beam irradiation step and an optical semiconductor element, alternatively, in a case of a molded body, that can exhibit an excellent light resistance, and that can suppress change in reflective index even when being left under a high temperature, and to provide a method of manufacturing the molded body, the electron beam curable resin composition, a resin frame for the reflector, and the reflector.SOLUTION: In a method of manufacturing a semiconductor light-emitting device, a reflector is obtained by: an injection molding step of performing injection molding of an electron beam curable resin composition containing polymethylpentene, and titanium oxide subjected to surface treatment by an aluminum compound, surface treatment by a silicon compound, and a surface treatment by a siloxane compound or a polyol compound; and an electron beam irradiation step of performing electron beam irradiation before or/and after the injection molding step. |
