LASER PROCESSOR, LASER PROCESSING METHOD AND LASER OSCILLATOR

摘要

PROBLEM TO BE SOLVED: To provide a laser processor which can remove debris which is adhered in a wide range while reducing a laser output, a laser processing method, and a laser oscillator which oscillates a laser beam for abrasion processing.SOLUTION: A laser processor related to one embodiment of this invention comprises: an oscillator 1 which oscillates a processing beam 51 for abrasion-processing a product 4 to be processed, and a debris removing beam 52 for removing debris 102 which is generated by the abrasion processing; and a holding device 3 for holding the product 4 to be processed. The laser processing beam 51 is radiated to the product 4 to be processed which is held at the holding device 3, the debris removing beam 52 is radiated to a radiation position of the laser processing beam 51 of the product 4 to be processed or the vicinity of the radiation position, and a radiation shape of the debris removing beam 52 in the product 4 to be processed is linear.