发明名称 LED MOLD
摘要 <p>The present invention relates to an LED mold. To manufacture an LED material, a plurality of reflectors are molded on a lead frame. The magnitude of force required for a singulation process for individualizing the lead frame having the reflectors is minimized. At the same time, impact and damage applied to individualized LED materials are minimized.</p>
申请公布号 KR20150011643(A) 申请公布日期 2015.02.02
申请号 KR20130086851 申请日期 2013.07.23
申请人 发明人
分类号 H01L21/56;H01L33/52 主分类号 H01L21/56
代理机构 代理人
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