| 摘要 |
本发明揭示一种用于检查一晶圆之基于电脑的方法，其包含：将电脑可读取指令储存在至少一个电脑之一记忆体元件中；侦测绕一第一中心轴以一第一螺旋形旋转之一第一光束；及使用该至少一个电脑之一处理器执行该等电脑可读取指令以使用该所侦测第一光束产生包含至少一个形状之一影像；判定该至少一个形状之一定向或该至少一个形状之一大小；及根据该定向或该大小计算该晶圆中之一缺陷之一深度。; detecting a first light beam rotating in a first spiral about a first central axis; and executing, using a processor for the at least one computer, the computer readable instructions to generate, using the detected first light beam, an image including at least one shape, determine an orientation of the at least one shape or a size of the at least one shape, and calculate a depth of a defect in the wafer according to the orientation or the size. |
