带硬化膜透明基材的制造方法、感光性树脂组成物、感光性元件、及电子零件;METHOD FOR MANUFACTURING TRANSPARENT SUBSTRATE WITH CURED FILM, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND ELECTRONIC PART

摘要

本发明的带硬化膜透明基材的制造方法的特征在于：于透明基材上设置包含感光性树脂组成物的感光层，藉由光化射线的照射使感光层的既定部分硬化后，将感光层的既定部分以外去除，形成将基材的一部分或全部被覆且包含所述感光性树脂组成物的硬化物的硬化膜，其中所述感光性树脂组成物含有黏合剂聚合物、光聚合性化合物及光聚合起始剂，所述光聚合性化合物含有选自由具有来源于二-三羟甲基丙烷的骨架的(甲基)丙烯酸酯化合物及具有来源于二甘油的骨架的(甲基)丙烯酸酯化合物所组成的组群中的至少一种(甲基)丙烯酸酯化合物。; curing a determined part of the photosensitive layer by irradiating an actinic ray and removing a part other than the determined part of the photosensitive layer before forming a cured film which covers a part of or all of the substrate and contains a cured produce containing the photosenstive resin composition, wherein the photosensitive resin composition contains a binder polymer, a photopolymerizable compound and a photopolymerization initiator. The photopolymerizable compound contains at least one kind of (meth)acrylate compounds selected from a group consisting of a (meth)acrylate compound having a skeleton from di(trimethylol)propane and a (meth)acrylate compound having a skeleton from a diglycerin.