| 摘要 |
<p>The present invention relates to a soldering apparatus for a printed circuit board. The soldering apparatus includes a jig which allows a PCB having components to be mounted on an upper side and allows a soldering region between the components and the PCB to be exposed to a lower side, a storage bath which stores molten solder, a gripper which includes a first function which moves by the transmission of power from the outside and bines the jig in a moving process, and a second function which moves the jig to allow the soldering region to be dipped in the storage bath, and a support unit which pressurizes the components without moving the component in a dipping process.</p> |
