| 摘要 |
The present invention relates to a positive type photosensitive resin composition, which comprises (A) a polymer manufactured by radical-co-polymerizing (a1) a radical polymerizable monomer represented by formula (I), (a2) a radical polymerizable monomer having an acidic group, (a3) a radical polymerizable monomer having alkoxysilyl, and (a4) a radical polymerizable monomer other than (a1), (a2) and (a3); (B) a photo acid generator; and (C) an organic solvent. The positive type photosensitive resin composition of the present invention is high sensitive, and does not require sintering after exposure. By using the positive type photosensitive resin composition, a patterned transparent film with excellent pattern adhesion in development, and post exposure delay stability can be formed. In formula I, R1 is hydrogen, or C1-5 alkyl having any hydrogen possibly substituted with fluorine; R2 is hydrogen or a functional group with 1-3-dioxopropane-1,3-diyl (-COCH2CO-); and n is an integer of 1-6. |
