发明名称 Flexible laminated plate for printed circuit - comprises polyamide resin plastic film with copper foil contacts etc., and e.g. cadmium-copper alloy backing layer
摘要 <p>The plate comprises a flexible plastic film of polyamide resin on which a Cu foil is pasted to form contacts, terminals and circuit parts and an elastic metal layer of e.g. Cd-Cu alloy which is applied (partially) to the back side of the plastic film. The plastic film is folded and overlapped to sandwich one face having holes between other faces so as to form a printed circuit plate such as switch plate for a key board of a thin miniaturised electrocomputor. Then, the whole or only contact parts on the back side of the film face are coated with the elastic metal layer. The plate has the strength against the folding damage and deformation and may be used to produce the key board of a miniaturised electrocomputor which is of thin construction and long life.</p>
申请公布号 FR2400820(A1) 申请公布日期 1979.03.16
申请号 FR19780024035 申请日期 1978.08.17
申请人 BUNKER RAMO CORP 发明人 TAKEO NAKAGUCHI ET KIYOTO FURUYA;FURUYA KIYOTO
分类号 B32B15/04;B32B15/08;H01H13/702;H01H13/785;H05K1/00;H05K1/09;H05K3/38;(IPC1-7):05K1/04;05K7/02 主分类号 B32B15/04
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