EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART AND PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART

摘要

The present invention provides an embedded type multi-layered ceramic electronic component to decrease a current path, thereby reducing the equivalent series inductance and to improve the detachment between multi-layered ceramic electronic components and embedding board by including: a ceramic body which includes a dielectric layer, first and second main surfaces which face with each other, first and side surfaces which face with each other, and first and second cross sections; an active layer which is formed by including first and second internal electrodes which are alnternatedly exposed through both cross sections of the ceramic body while having the dielectric layer in between; upper and lower cover layers which are formed on the top and bottom of the active layer; and first and second external electrodes which are formed at both ends of the ceramic body. The first external electrode include a first bottom electrode and a first terminal electrode which is formed on the first bottom electrode. The second external electrode include a second bottom electrode and a second terminal electrode which is formed on the second bottom electrode, wherein the equation 4μm <= tc <= 20μm is satisfied where the thickness of the upper and lower cover layers is tc.