发明名称 CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE OF CERAMIC ELECTRONIC COMPONENT
摘要 <p>Provided by the present invention is a ceramic electronic component which prevents a crack from being generated easily when being mounted using a mounter. The central part of a first principal surface (10a) protrudes more than the edge part of the first principal surface (10a). A size in a width direction W of first and second principal surfaces (10a, 10b) of a component main body (10) is shorter than a size in a longitudinal direction L of the first and second principal surfaces (10a, 10b) of the component main body (10). In a thickness direction T, the highest part of a part positioned on each first principal surface (10a) of first and second terminal electrodes (15, 16) is positioned in an outer part of the thickness direction than the highest part of the thickness direction T of the first principal surface (10a).</p>
申请公布号 KR20150010685(A) 申请公布日期 2015.01.28
申请号 KR20140174229 申请日期 2014.12.05
申请人 MURATA MANUFACTURING CO., LTD. 发明人 AKAZAWA TEPPEI;SASAKI TOMOHIRO
分类号 H01G4/12;H01G2/06;H01G4/232;H01G4/30 主分类号 H01G4/12
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