CIRCUIT BOARD AND METHOD FOR PRODUCING SAME

摘要

To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate 31 that configures this wiring board 10 includes multiple connection terminal portions 41 and wiring conductors 62 as a conductor layer 24 of the outermost layer. The wiring conductors 62 are arranged at predetermined positions, passing through between multiple connection terminal portions 41 for flip-chip mounting a semiconductor chip 51. A resin insulating layer 23 of the outermost layer of the laminate has a dam portion 63 and a reinforcement portion 64. The dam portion 63 covers the wiring conductors 62. The reinforcement portion 64 is formed, between the wiring conductor 62 and the connection terminal portion 41 that is adjacent to the wiring conductor 62, lower than a height H3 of the dam portion 63. The reinforcement portion 64 is concatenated with a side surface of the dam portion 63.