MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To eliminate the warp and the like of the substrate and thus to enhance the yield of isolation by adhering the Si substrate containing plural units of photo detectors to the insulating holder plate containing holes corresponding to those detectors and then cutting the Si substrate into pieces with the holder plate reserved. CONSTITUTION:Si substrate 11 to which individual element 14a and 14b (photo detectors) are provided is polished and thinned down to a fixed thickness to be adhered to holding substrate 17 such as the sapphire or glass plate containing holes 18 corresponding to the individual elements via adhesive 16 of silicon resin group or the like. Then groove 21 reaching adhesive 16 from substrate 11 is cut by means of a dicing saw or laser scriber to isolate the individual elements from each other. In such way, the individual elements can be isolated in a simple way without using any dielectric isolator and the like. Then luminous elemtns 19a and 19b provided at the concave part of package 22 are made to oppose to elements 14a and 14b via holes 18, and at the same time substrate 17 and package 20 are assembled together.