| 摘要 |
<p>According to a sputtering apparatus of the present invention, one gas pipe (21) is connected with at least two gas supply pipes (22). The gas supply pipe (22) and the gas pipe (21) are installed outside a partition wall (20) surrounding a target (18), and a plurality of gas inlets (23) are formed inside the partition wall (20). A plurality of the gas inlets (23) are formed not on the surface of the target (18) but in the side far from a film forming roll (15). A cooling pipe (24) to cool the partition wall (20) is formed.</p> |
