发明名称 THIN FILM FORMING APPARATUS
摘要 <p>The purpose of the present invention is to provide a film forming apparatus capable of suppressing the variation in quality with respect to the width direction of a long film substrate of a formed thin film than a conventional method. To achieve the objective of the present invention, a gas supply means (100, 200) to supply a gas to form a film comprises: a plurality of gas supply parts (120A, 120B, 120C, 220A, 220B, 220C) listed and formed in the width direction of a film substrate (16) inside a vacuum chamber (12); and a supply amount adjusting part to adjust an amount of supply of gas for each gas supply part (120A-C, 220A-C). Moreover, a gas partial pressure measuring means (400) to measure the partial pressure for each gas type inside the vacuum chamber (12) comprises: measuring parts (420A, 420B, 420C) installed to correspond to each installation location of the gas supply parts (120A-C, 220A-C) with respect to the width direction of the film substrate (16), and the gas partial pressure measuring means (400) capable of measuring the partial pressure of a gas in each installation location of the measuring parts (420A-C).</p>
申请公布号 KR20150010595(A) 申请公布日期 2015.01.28
申请号 KR20140084412 申请日期 2014.07.07
申请人 NITTO DENKO CORPORATION 发明人 NASHIKI TOMOTAKE;HAMADA AKIRA
分类号 C23C14/34;C23C14/54 主分类号 C23C14/34
代理机构 代理人
主权项
地址