| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition for primer layers, which is used for improving adhesiveness between a copper foil and a polyimide resin (insulating resin layer) without roughening the copper foil. <P>SOLUTION: The resin composition for primer layers contains a ring-closure type polyimide (A) and an epoxy resin (B), wherein the ring-closure type polyimide (A) contains a segment represented by formula (1) (wherein, Ar<SB>1</SB>represents one or more tetravalent aromatic groups selected from aromatic groups linked through a direct bond, an ether bond, a carbonyl bond, a sulfonyl bond or 1-3C alkylene bond; Ar<SB>2</SB>represents one or more divalent aromatic groups selected from aromatic groups linked through a direct bond, an ether bond, a sulfonyl bond, an amide bond or 1-3C alkylene bond; and each aromatic ring independently has a hydrogen atom, a hydroxy group, a carboxy group or a 1-3C alkyl group). <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
