发明名称 半導体発光装置及びその製造方法
摘要 PROBLEM TO BE SOLVED: To solve such a problem that a conventional glass sealing structure is not easily manufactured when the life of an LED device, in which a fluorescent material is unevenly distributed around an LED element to reduce color unevenness between azimuth angles, is increased.SOLUTION: A semiconductor light emitting device includes a glass 31 having a recessed part 31a having a flat bottom part, and an LED element 36 is disposed so as to have gaps in the bottom part and side parts of the recessed part 31. The gaps are filled with a fluorescent material 32. Most parts of the fluorescent material 32 is sealed by the glass 31 and the life of the fluorescent material 32 is increased. Further, a gas barrier layer 37 is formed on a lower surface of the fluorescent material 32 and a lower surface of the glass 31.
申请公布号 JP5661552(B2) 申请公布日期 2015.01.28
申请号 JP20110104088 申请日期 2011.05.09
申请人 シチズンホールディングス株式会社;シチズン電子株式会社 发明人 今津 健二
分类号 H01L33/54;H01L33/50 主分类号 H01L33/54
代理机构 代理人
主权项
地址