发明名称 平行昇降機構および半導体製造装置
摘要 PROBLEM TO BE SOLVED: To provide a technique capable of maintaining parallelism of one clamper to another clamper.SOLUTION: In a parallel lifting mechanism 40 allowing a lower clamper 28 to move up and down toward an upper clamper 27, a leveling unit 29 is inserted by contacting with an opposite internal wall surface of a slide hole 26a. The leveling unit 29 includes a mounting block 52 for mounting the lower clamper, and a spring 51 disposed between the mounting block 52 and an opposite internal wall surface of the slide hole 26a. The leveling unit 29 slides inside the slide hole 26a while continuously positioning the mounting block 52 by pressing it to the internal wall surface of the slide hole 26a by the spring 51, to guide the vertical movement of the lower clamper 28 disposed on the mounting block 52.
申请公布号 JP5659427(B2) 申请公布日期 2015.01.28
申请号 JP20110143367 申请日期 2011.06.28
申请人 アピックヤマダ株式会社 发明人 高橋 友一;中島 謙二;上原 克博;涌井 正明
分类号 H01L21/60;B23K1/00;B23K3/00;H01L21/603;H05K13/04 主分类号 H01L21/60
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