| 摘要 |
By using a solder alloy consisting essentially of 0.2 - 1.2 mass % of Ag, 0.6 - 0.9 mass % of Cu, 1.2 - 3.0 mass % of Bi, 0.02 - 1.0 mass % of Sb, 0.01 - 2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather. |
