| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the thermal peeling resistance of Sn plating formed on a Cu-Ni-Si based alloy sheet containing Zn. <P>SOLUTION: In the Cu-Ni-Si based copper alloy sheet containing, by mass, 1.0 to 4.0% Ni, 0.2 to 0.9% Si and 0.1 to 2.0% Zn, and the balance Cu with inevitable impurities, and subjected to solution treatment accompanied by recrystallization and aging treatment, Si oxide concentration upon sputtering by 0.2μm from the surface is controlled to≤1.5 mass% by Auger electron spectroscopy. By using an N<SB>2</SB>-H<SB>2</SB>gas as the atmospheric gas of the solution treatment or removing a surface layer by etching or polishing after the solution treatment, the Si oxide concentration can be controlled to≤1.5 mass%. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
