发明名称 REMOVABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET, AND CUTTING PROCESSING METHOD OF ELECTRONIC COMPONENTS
摘要 The present invention is to sufficiently fixate chips even after cutting the chips in a chip cutting process and to improve the yield by preventing scattering of chips when cutting chips. The present invention provides a removable adhesive composition, which comprises an acrylic copolymer (A) and a cross-linking agent (B), wherein the monomer component constituting the acrylic copolymer (A) consists of (a) alkyl (meth)acrylate ester having an alkyl group with 4 or less carbon atoms, (b) a co-monomer, in which a glass transition temperature (Tg) of the homopolymer thereof is 80°C or higher, and (c) a monomer which has functional groups capable of reacting with the cross-linking agent (B), and the ratio of (a) alkyl (meth)acrylate ester monomer is 50 weight% or more to the total monomer components.
申请公布号 KR20150010646(A) 申请公布日期 2015.01.28
申请号 KR20140090801 申请日期 2014.07.18
申请人 NITTO DENKO CORPORATION 发明人 KAWANISHI MICHIROU
分类号 C09J133/06;C09J7/02 主分类号 C09J133/06
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