发明名称 Power semiconductor module with at least one positioning means for a substrate
摘要 The module (1) has a housing (20) provided with a recess for a substrate (30). The substrate is designed as a switching substrate (36) i.e. insulated metal substrate, or a base plate. The housing comprises a positioning device (60) in a recess, where the positioning device is provided with a springy section (68) i.e. spring bracket, and a contact element (62). The contact element lies at side surfaces (300) of the substrate in a force-fit manner such that pressure is exerted on the contact element. The positioning device and the housing are made of insulating plastic.
申请公布号 EP2413357(A3) 申请公布日期 2015.01.28
申请号 EP20110172452 申请日期 2011.07.04
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG 发明人 LEDERER, MARCO;POPP, RAINER
分类号 H01L25/07;H01L23/02;H01L23/04;H01L23/053;H01L23/373 主分类号 H01L25/07
代理机构 代理人
主权项
地址