发明名称 |
Power semiconductor module with at least one positioning means for a substrate |
摘要 |
The module (1) has a housing (20) provided with a recess for a substrate (30). The substrate is designed as a switching substrate (36) i.e. insulated metal substrate, or a base plate. The housing comprises a positioning device (60) in a recess, where the positioning device is provided with a springy section (68) i.e. spring bracket, and a contact element (62). The contact element lies at side surfaces (300) of the substrate in a force-fit manner such that pressure is exerted on the contact element. The positioning device and the housing are made of insulating plastic. |
申请公布号 |
EP2413357(A3) |
申请公布日期 |
2015.01.28 |
申请号 |
EP20110172452 |
申请日期 |
2011.07.04 |
申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG |
发明人 |
LEDERER, MARCO;POPP, RAINER |
分类号 |
H01L25/07;H01L23/02;H01L23/04;H01L23/053;H01L23/373 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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