| 摘要 |
<p>Provided are a heat-peelable adhesive tape for cutting electronic components, and a cutting method of electronic components using the heat-peelable adhesive tape, wherein the heat-peelable adhesive tape has sufficient holding characteristic in a cutting process of electronic components, and leaves no electrode contamination on the electronic components after the heating-peeling process. The heat-peelable adhesive tape is a heat-peelable adhesive tape having a heat expansion adhesive layer, wherein the probe tack of the heat-expansion adhesive layer is 60 N/5mmφor more (deposition speed: 30 mm/min, test speed: 30 mm/min, preliminary load: 100 gf, compression time: 1.0 sec).</p> |
