| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board which incorporates an electronic component, is thin, and has high connection reliability. <P>SOLUTION: An IC chip 90 is incorporated in a first resin insulating layer 50, and a second resin insulating layer 60 is formed on the first resin insulating layer 50. A second conductor layer 58 thicker than a third conductor layer 68 is disposed at an interface between the first resin insulating layer 50 and the second resin insulating layer 60. The second conductor layer 58 is sandwiched between a first surface of the first resin insulating layer 50 and a second surface of the second resin insulating layer 60. Therefore, warpage is reduced, thereby allowing connection reliability to be enhanced. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
