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发明名称
化合物半導体装置の製造方法
摘要
申请公布号
JP5660150(B2)
申请公布日期
2015.01.28
申请号
JP20130053256
申请日期
2013.03.15
申请人
发明人
分类号
H01L21/338;H01L21/205;H01L21/336;H01L29/778;H01L29/78;H01L29/812
主分类号
H01L21/338
代理机构
代理人
主权项
地址
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