发明名称 |
PRINTED SUBSTRATE MANUFACTURING METHOD AND PRINTED SUBSTRATE EMPLOYING SAME |
摘要 |
<p>A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating (6) having a stem (7) as a portion of plating up to a level equal to the height of the mask layer, and a cap (8) as a portion of plating exceeding the height of the mask layer and having an outgrowth (8a) lying over the surface of the mask layer; laminating an insulating base (10) on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating (6) to form a circuit board intermediate in which the pattern plating (6) is buried in the insulating base (10); removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem (7) of the pattern plating is removed, to increase the line width of the conductive pattern on the exposed surface.</p> |
申请公布号 |
EP2563105(A4) |
申请公布日期 |
2015.01.28 |
申请号 |
EP20110771803 |
申请日期 |
2011.03.02 |
申请人 |
MEIKO ELECTRONICS CO., LTD. |
发明人 |
SAITO, YOICHI;MICHIWAKI, SHIGERU;TANEKO, NORIAKI;TAKII, SHUKICHI |
分类号 |
H05K3/20;H05K3/26 |
主分类号 |
H05K3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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