| 摘要 |
<p>A method for cleaning a nozzle of a material deposition system configured to deposit material on an electronic substrate includes: performing a deposition operation with a material deposition system configured to position an electronic substrate under a deposition head movable by a gantry, to supply material to a chamber of the deposition head, to extend a piston of the deposition head from the chamber, the needle terminating in a needle orifice, and to push a volume of material out of the chamber by an actuator of the deposition head to form a desired volume of material at the needle orifice that is deposited on the electronic substrate; and cleaning the needle orifice with air directed to the needle orifice.</p> |
