| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide: an adhesive for sealing a semiconductor with which generation of voids is sufficiently controlled even in high temperature connection, and flux activity of a flux agent is obtained effectively; a production method therefor; and a semiconductor device produced by using the adhesive for sealing the semiconductor. <P>SOLUTION: This adhesive for sealing the semiconductor is obtained by removing at least a part of organic solvent from an adhesive varnish containing (a) an epoxy resin, (b) an epoxy resin-curing agent, (c) a flux agent and (d) an organic solvent, so as to satisfy the following formulae (I) and (II). The formula (I) is [(reaction initiation temperature of adhesive for sealing semiconductor)≥(boiling point of (d) organic solvent)]. The formula (II) is [0.5≤(content (mass%) of (d) organic solvent in adhesive for sealing semiconductor)≤1.5]. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
