发明名称 多重ビーム穿孔システム
摘要 <p>A method for laser drilling of holes in a substrate (44) with varying simultaneity including operating a laser (22) to produce a single output beam (24) whose pulses have a total energy, dividing the single output beam into plural beams (41) to an extent which varies over time and applying the plural beams to plural hole drilling locations (209, 210, 212, 214, 216, 218, 220, 222) on the substrate including simultaneously drilling first parts of multiple holes using corresponding ones of the plural beams having a pulse energy which is a first fraction of the total energy and thereafter drilling at least one second part of at least one of the multiple holes using at least one of the plural beams each having a pulse energy which is at least a second fraction of the total energy, the second fraction being different from the first fraction.</p>
申请公布号 JP5659020(B2) 申请公布日期 2015.01.28
申请号 JP20100541887 申请日期 2009.01.11
申请人 发明人
分类号 B23K26/382;B23K26/00;B23K26/067 主分类号 B23K26/382
代理机构 代理人
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