| 摘要 |
A Micro Electro Mechanical systems (MEMS) device includes a solder bump (20) on a substrate (12), a CMOS-MEMS die (14,16) comprising a CMOS die (16) and a MEMS die (14), and stud bumps (22) on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps (22) and the solder bumps (20) are positioned to provide an electrical connection between the CMOS die and the substrate. A polymer (18) is shown surrounding the stund bumps and solder bumps. |
