发明名称 |
Cooling fluid flow passage matrix for electronics cooling |
摘要 |
A cooling supply package for an electronic component 22 has a supply port 17 communicating with a plurality of outer supply channels, and a return port 19 communicating with a plurality of outer return channels. The outer supply channels and outer return channels communicate with distinct ones of openings in a slot layer and into return and supply slots, respectively. An orifice layer 34 supplies fluid to an electronic component from supply slots and receives return fluid into the return slots after having cooled the electronic component. A cooling supply and electronic combination is also disclosed. |
申请公布号 |
EP2830088(A2) |
申请公布日期 |
2015.01.28 |
申请号 |
EP20140177118 |
申请日期 |
2014.07.15 |
申请人 |
HAMILTON SUNDSTRAND CORPORATION |
发明人 |
HIMMELMANN, RICHARD A.;TURNEY, JOSEPH |
分类号 |
H01L23/473;H05K7/20 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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