| 摘要 |
The present invention relates to a pattern transfer mold and a pattern formation method. According to an embodiment of the present invention, the pattern transfer mold comprises a substrate, a first laminated body, a second laminated body, a first electrode and a second electrode. The substrate comprises a base unit including a first surface, a first convex unit supplied on the first surface and having a first side, and a second convex unit supplied on the first surface, separated from the first convex unit and having a second side facing the first side. The first laminated body is supplied to the first side, and includes a first conductive layer and a first insulating layer. The second laminated body is supplied to the second side, and separated from the first laminated body, and includes a second conductive layer and a second insulating layer. The first electrode is electrically connected to at least one among first conductive layers. The second electrode is electrically connected to at least one among second conductive layers. |
