发明名称 |
PRINTED CIRCUIT BOARD SUBSTRATE HAVING METAL POST AND THE METHOD OF MANUFACTURING THE SAME |
摘要 |
<p>A printed circuit board substrate having a metal post according to the present application includes a step of preparing a stack substrate which has a circuit line layer formed on an outer surface; a step of forming a register pattern to partly expose the surface of the circuit line layer on the stack substrate; a step of forming a metal layer for a post on the front surface of the stack substrate including the circuit line layer and the register pattern; a step of forming a mask pattern to selectively block the metal layer for a post in a region for forming a post; a step of forming a metal post by etching an exposed part of the metal post for a post by using the mask pattern as an etch mask; and a step of forming a solder mask pattern to cover part of the sidewall of the metal post and the circuit line layer.</p> |
申请公布号 |
KR20150009671(A) |
申请公布日期 |
2015.01.27 |
申请号 |
KR20130083845 |
申请日期 |
2013.07.16 |
申请人 |
SIMM TECH CO., LTD. |
发明人 |
YIM, YUN HO;LEE, JONG TAE |
分类号 |
H05K3/46;H01L23/12 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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