| 发明名称 |
MECHANISMS FOR FORMING BONDING STRUCTURES |
| 摘要 |
Provided are the embodiments of mechanisms for forming a package. A package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive filter boned to the contact pad by a solder formed between a conducive filler and the contact pad. The solder is in direct contact with the conductive filler. |
| 申请公布号 |
KR20150009907(A) |
申请公布日期 |
2015.01.27 |
| 申请号 |
KR20130131294 |
申请日期 |
2013.10.31 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LIN. YEONG JYH;LIAO HSIN HUNG;HWANG CHIEN LING;JANG BOR PING;LIANG HSIAO CHUNG;LIU CHUNG SHI |
| 分类号 |
H01L23/48;H01L23/12 |
主分类号 |
H01L23/48 |
| 代理机构 |
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代理人 |
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| 主权项 |
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