发明名称 Measuring Method For Three-dimensional Thickness Profile
摘要 <p>The present invention provides a signal processing method for the thickness and shape of a thin film. The signal processing method comprises: a step of extracting a measurement phase signal by processing an interference signal containing information of the thickness and surface shape of a thin film in the provided refractive index of the thin film and the provided incident angle; a step of calculating the thickness of the thin film corresponding to the information on the thickness of the thin film using the theoretical phase of the thin film according to the thickness of the thin film and a wave number and the measurement phase signal; and a step of extracting the height of the top surface corresponding to the information on the surface shape using the difference between the measurement phase signal and the theoretical phase of the thin film.</p>
申请公布号 KR101486271(B1) 申请公布日期 2015.01.27
申请号 KR20130053536 申请日期 2013.05.13
申请人 发明人
分类号 G01B9/02;G01B11/06 主分类号 G01B9/02
代理机构 代理人
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