| 摘要 |
<p>The present invention relates to an MEMS sensor package. The MEMS sensor package according to the present invention comprises a base unit, an joint unit formed in embossed and engraved patterns on one surface of the base unit, an adhesive layer formed by coating an adhesive on the engraving pattern, and an MEMS sensor attached to the adhesive layer. Accordingly, the MEMS sensor package can conveniently control the size of the adhesive layer where the MEMS sensor is attached, and conveniently control the thickness of the adhesive layer. The MEMS sensor package can form the adhesive layer to have a smaller size than the MEMS sensor, thereby remarkably reducing the attachment area, and minimizing the package stress according to a die attachment process.</p> |
